深圳市道丰宁科技有限公司

High thermal conductivity, high extrusion rate, low volatility, suitable for filling gaps between various heating power devices and heat dissipation interfaces

High thermal conductivity, low thermal resistance, high thixotropy, high extrusion rate, non curing type, suitable for filling gaps between various heating power devices and heat dissipation interfaces

Single component, 100% solid content, no VOC volatile compounds, UV light moisture dual curing, salt spray resistance, mold resistance, corrosion resistance, insulation and other properties

Environmentally friendly water-based, low odor, non-toxic, non corrosive, no flash point, no foam, suitable for cleaning SMT steel mesh, screen, rosin, solder paste.